載入中
NYSETechnologySemiconductors
最新資料
US$47.60
+US$0.07 · +0.15%
Established in 1984 and headquartered in Kaohsiung, Taiwan, ASE Technology Holding Co., Ltd. operates as a leading global provider of essential services for the semiconductor industry. Its primary business encompasses a full range of semiconductor packaging and testing solutions, alongside electronic manufacturing services, catering to an international clientele spanning the United States, Taiwan, various other Asian countries, and Europe. The company offers an extensive portfolio of packaging services, featuring advanced techniques such as flip chip ball grid array (BGA) and chip scale package (CSP) formats. This also includes a variety of quad flat packages (including low profile and thin versions), bump chip carriers, and advanced quad flat no-lead (QFN) packages. ASE specializes in cutting-edge solutions like plastic BGAs, 3D chip packages, and stacked die integration, utilizing both copper and silver wire bonding. Further sophisticated offerings include specialized flip chip BGAs with heat-spreaders, hybrid FCCSPs, innovative package in package (PiP) and package on package (PoP) assemblies, advanced single-sided substrates, high-bandwidth PoP, fan-out wafer-level packaging, SESUB technology, and 2.5D silicon interposers. Additionally, the company produces IC wire bonding packages, system-in-package (SiP) products and modules, and provides critical interconnect materials, including the assembly of electronic components for the automotive sector. In the domain of semiconductor testing, ASE delivers a comprehensive array of services. These range from initial front-end engineering testing and wafer probing to the final verification of a diverse set of components, such as logic, mixed-signal, radio frequency (RF) modules, SiP, micro-electro-mechanical systems (MEMS), and discrete devices. The company also manages associated test services and drop shipment logistics. Beyond its core semiconductor operations, ASE Technology Holding diversifies its ventures significantly. This includes the development, construction, sale, leasing, and management of real estate properties. The company also manufactures substrates, offers information software solutions, provides equipment leasing and investment advisory services, and manages warehousing operations. Furthermore, ASE is involved in processing and distributing computer and communication peripherals, electronic components, telecommunications equipment, and motherboards, actively participating in the import and export of goods and technology.
收盤時
US$47.60
+US$0.07 · +0.15%
盤後
US$47.51
−US$0.09 · -0.19%
10月13日 下午4:24 ET
盤中時間採用ET。市場資料可能有所延遲。
Established in 1984 and headquartered in Kaohsiung, Taiwan, ASE Technology Holding Co., Ltd. operates as a leading global provider of essential services for the semiconductor industry. Its primary business encompasses a full range of semiconductor packaging and testing solutions, alongside electronic manufacturing services, catering to an international clientele spanning the United States, Taiwan, various other Asian countries, and Europe. The company offers an extensive portfolio of packaging services, featuring advanced techniques such as flip chip ball grid array (BGA) and chip scale package (CSP) formats. This also includes a variety of quad flat packages (including low profile and thin versions), bump chip carriers, and advanced quad flat no-lead (QFN) packages. ASE specializes in cutting-edge solutions like plastic BGAs, 3D chip packages, and stacked die integration, utilizing both copper and silver wire bonding. Further sophisticated offerings include specialized flip chip BGAs with heat-spreaders, hybrid FCCSPs, innovative package in package (PiP) and package on package (PoP) assemblies, advanced single-sided substrates, high-bandwidth PoP, fan-out wafer-level packaging, SESUB technology, and 2.5D silicon interposers. Additionally, the company produces IC wire bonding packages, system-in-package (SiP) products and modules, and provides critical interconnect materials, including the assembly of electronic components for the automotive sector. In the domain of semiconductor testing, ASE delivers a comprehensive array of services. These range from initial front-end engineering testing and wafer probing to the final verification of a diverse set of components, such as logic, mixed-signal, radio frequency (RF) modules, SiP, micro-electro-mechanical systems (MEMS), and discrete devices. The company also manages associated test services and drop shipment logistics. Beyond its core semiconductor operations, ASE Technology Holding diversifies its ventures significantly. This includes the development, construction, sale, leasing, and management of real estate properties. The company also manufactures substrates, offers information software solutions, provides equipment leasing and investment advisory services, and manages warehousing operations. Furthermore, ASE is involved in processing and distributing computer and communication peripherals, electronic components, telecommunications equipment, and motherboards, actively participating in the import and export of goods and technology.
日內區間
目前US$47.60
52週區間
目前US$47.60
盤中時間採用ET。市場資料可能有所延遲。
Established in 1984 and headquartered in Kaohsiung, Taiwan, ASE Technology Holding Co., Ltd. operates as a leading global provider of essential services for the semiconductor industry. Its primary business encompasses a full range of semiconductor packaging and testing solutions, alongside electronic manufacturing services, catering to an international clientele spanning the United States, Taiwan, various other Asian countries, and Europe. The company offers an extensive portfolio of packaging services, featuring advanced techniques such as flip chip ball grid array (BGA) and chip scale package (CSP) formats. This also includes a variety of quad flat packages (including low profile and thin versions), bump chip carriers, and advanced quad flat no-lead (QFN) packages. ASE specializes in cutting-edge solutions like plastic BGAs, 3D chip packages, and stacked die integration, utilizing both copper and silver wire bonding. Further sophisticated offerings include specialized flip chip BGAs with heat-spreaders, hybrid FCCSPs, innovative package in package (PiP) and package on package (PoP) assemblies, advanced single-sided substrates, high-bandwidth PoP, fan-out wafer-level packaging, SESUB technology, and 2.5D silicon interposers. Additionally, the company produces IC wire bonding packages, system-in-package (SiP) products and modules, and provides critical interconnect materials, including the assembly of electronic components for the automotive sector. In the domain of semiconductor testing, ASE delivers a comprehensive array of services. These range from initial front-end engineering testing and wafer probing to the final verification of a diverse set of components, such as logic, mixed-signal, radio frequency (RF) modules, SiP, micro-electro-mechanical systems (MEMS), and discrete devices. The company also manages associated test services and drop shipment logistics. Beyond its core semiconductor operations, ASE Technology Holding diversifies its ventures significantly. This includes the development, construction, sale, leasing, and management of real estate properties. The company also manufactures substrates, offers information software solutions, provides equipment leasing and investment advisory services, and manages warehousing operations. Furthermore, ASE is involved in processing and distributing computer and communication peripherals, electronic components, telecommunications equipment, and motherboards, actively participating in the import and export of goods and technology.
日內區間
目前US$47.60
52週區間
目前US$47.60
已公布業績及可用的市場共識預估。
已公布業績及可用的市場共識預估。
第三方分析師預期可能變動，並非 GoAI 建議。
| 行動 | 生效日期 | 詳情 | 記錄日期 | 付款日期 |
|---|---|---|---|---|
股票分割 | 2018年4月18日 | 5:4 | — | — |
股票分割 | 2012年8月20日 | 1,139:1,000 | — | — |
股票分割 | 2011年8月12日 | 557:500 | — | — |
股票分割 | 2010年7月27日 | 109:100 | — | — |
股票分割 | 2008年8月13日 | 1,029:1,000 | — | — |
股票分割 | 2007年8月20日 | 11,479:10,000 | — | — |
已生效 2018年4月18日
5:4
已生效 2012年8月20日
1,139:1,000
已生效 2011年8月12日
557:500
已生效 2010年7月27日
109:100
已生效 2008年8月13日
1,029:1,000
已生效 2007年8月20日
11,479:10,000
報告持有此股票曝險的交易所交易基金。
iShares Semiconductor ETFSOXX4.43億0.99%——US$541.91—
Avantis Emerging Markets Equity ETFAVEM1.76億0.63%——US$92.765—
Direxion Daily Semiconductor Bull 3X ETFSOXL1.42億0.68%——US$126.26—
YieldMax Semiconductor Portfolio Option Income ETFCHPY6290.06萬4.68%——US$66.005—
Amplify CWP International Enhanced Dividend Income ETFIDVO4496.24萬3.14%——US$41.585—
Dimensional - Emerging Core Equity Market ETFDFAE3125.1萬0.31%——US$38.86—
Avantis Emerging Markets Value ETFAVES2790.73萬1.79%——US$65.24—
Dimensional - Emerging Markets Value ETFDFEV1904.06萬0.87%——US$42.18—iShares Semiconductor ETFSOXXAvantis Emerging Markets Equity ETFAVEMDirexion Daily Semiconductor Bull 3X ETFSOXLYieldMax Semiconductor Portfolio Option Income ETFCHPYAmplify CWP International Enhanced Dividend Income ETFIDVODimensional - Emerging Core Equity Market ETFDFAEAvantis Emerging Markets Value ETFAVESDimensional - Emerging Markets Value ETFDFEVAI 生成內容及延遲市場資料僅供資訊與教育用途，不構成投資建議。
