載入中
NYSETechnologySemiconductors
最新資料
US$47.53
+US$1.10 · +2.37%
Established in 1984 and headquartered in Kaohsiung, Taiwan, ASE Technology Holding Co., Ltd. operates as a leading global provider of essential services for the semiconductor industry. Its primary business encompasses a full range of semiconductor packaging and testing solutions, alongside electronic manufacturing services, catering to an international clientele spanning the United States, Taiwan, various other Asian countries, and Europe. The company offers an extensive portfolio of packaging services, featuring advanced techniques such as flip chip ball grid array (BGA) and chip scale package (CSP) formats. This also includes a variety of quad flat packages (including low profile and thin versions), bump chip carriers, and advanced quad flat no-lead (QFN) packages. ASE specializes in cutting-edge solutions like plastic BGAs, 3D chip packages, and stacked die integration, utilizing both copper and silver wire bonding. Further sophisticated offerings include specialized flip chip BGAs with heat-spreaders, hybrid FCCSPs, innovative package in package (PiP) and package on package (PoP) assemblies, advanced single-sided substrates, high-bandwidth PoP, fan-out wafer-level packaging, SESUB technology, and 2.5D silicon interposers. Additionally, the company produces IC wire bonding packages, system-in-package (SiP) products and modules, and provides critical interconnect materials, including the assembly of electronic components for the automotive sector. In the domain of semiconductor testing, ASE delivers a comprehensive array of services. These range from initial front-end engineering testing and wafer probing to the final verification of a diverse set of components, such as logic, mixed-signal, radio frequency (RF) modules, SiP, micro-electro-mechanical systems (MEMS), and discrete devices. The company also manages associated test services and drop shipment logistics. Beyond its core semiconductor operations, ASE Technology Holding diversifies its ventures significantly. This includes the development, construction, sale, leasing, and management of real estate properties. The company also manufactures substrates, offers information software solutions, provides equipment leasing and investment advisory services, and manages warehousing operations. Furthermore, ASE is involved in processing and distributing computer and communication peripherals, electronic components, telecommunications equipment, and motherboards, actively participating in the import and export of goods and technology.
一般交易時段
US$47.23
−US$0.30 · -0.63%
盤中時間採用ET。市場資料可能有所延遲。
Established in 1984 and headquartered in Kaohsiung, Taiwan, ASE Technology Holding Co., Ltd. operates as a leading global provider of essential services for the semiconductor industry. Its primary business encompasses a full range of semiconductor packaging and testing solutions, alongside electronic manufacturing services, catering to an international clientele spanning the United States, Taiwan, various other Asian countries, and Europe. The company offers an extensive portfolio of packaging services, featuring advanced techniques such as flip chip ball grid array (BGA) and chip scale package (CSP) formats. This also includes a variety of quad flat packages (including low profile and thin versions), bump chip carriers, and advanced quad flat no-lead (QFN) packages. ASE specializes in cutting-edge solutions like plastic BGAs, 3D chip packages, and stacked die integration, utilizing both copper and silver wire bonding. Further sophisticated offerings include specialized flip chip BGAs with heat-spreaders, hybrid FCCSPs, innovative package in package (PiP) and package on package (PoP) assemblies, advanced single-sided substrates, high-bandwidth PoP, fan-out wafer-level packaging, SESUB technology, and 2.5D silicon interposers. Additionally, the company produces IC wire bonding packages, system-in-package (SiP) products and modules, and provides critical interconnect materials, including the assembly of electronic components for the automotive sector. In the domain of semiconductor testing, ASE delivers a comprehensive array of services. These range from initial front-end engineering testing and wafer probing to the final verification of a diverse set of components, such as logic, mixed-signal, radio frequency (RF) modules, SiP, micro-electro-mechanical systems (MEMS), and discrete devices. The company also manages associated test services and drop shipment logistics. Beyond its core semiconductor operations, ASE Technology Holding diversifies its ventures significantly. This includes the development, construction, sale, leasing, and management of real estate properties. The company also manufactures substrates, offers information software solutions, provides equipment leasing and investment advisory services, and manages warehousing operations. Furthermore, ASE is involved in processing and distributing computer and communication peripherals, electronic components, telecommunications equipment, and motherboards, actively participating in the import and export of goods and technology.
日內區間
目前US$47.23
52週區間
目前US$47.23
盤中時間採用ET。市場資料可能有所延遲。
Established in 1984 and headquartered in Kaohsiung, Taiwan, ASE Technology Holding Co., Ltd. operates as a leading global provider of essential services for the semiconductor industry. Its primary business encompasses a full range of semiconductor packaging and testing solutions, alongside electronic manufacturing services, catering to an international clientele spanning the United States, Taiwan, various other Asian countries, and Europe. The company offers an extensive portfolio of packaging services, featuring advanced techniques such as flip chip ball grid array (BGA) and chip scale package (CSP) formats. This also includes a variety of quad flat packages (including low profile and thin versions), bump chip carriers, and advanced quad flat no-lead (QFN) packages. ASE specializes in cutting-edge solutions like plastic BGAs, 3D chip packages, and stacked die integration, utilizing both copper and silver wire bonding. Further sophisticated offerings include specialized flip chip BGAs with heat-spreaders, hybrid FCCSPs, innovative package in package (PiP) and package on package (PoP) assemblies, advanced single-sided substrates, high-bandwidth PoP, fan-out wafer-level packaging, SESUB technology, and 2.5D silicon interposers. Additionally, the company produces IC wire bonding packages, system-in-package (SiP) products and modules, and provides critical interconnect materials, including the assembly of electronic components for the automotive sector. In the domain of semiconductor testing, ASE delivers a comprehensive array of services. These range from initial front-end engineering testing and wafer probing to the final verification of a diverse set of components, such as logic, mixed-signal, radio frequency (RF) modules, SiP, micro-electro-mechanical systems (MEMS), and discrete devices. The company also manages associated test services and drop shipment logistics. Beyond its core semiconductor operations, ASE Technology Holding diversifies its ventures significantly. This includes the development, construction, sale, leasing, and management of real estate properties. The company also manufactures substrates, offers information software solutions, provides equipment leasing and investment advisory services, and manages warehousing operations. Furthermore, ASE is involved in processing and distributing computer and communication peripherals, electronic components, telecommunications equipment, and motherboards, actively participating in the import and export of goods and technology.
日內區間
目前US$47.23
52週區間
目前US$47.23
第三方分析師預期可能變動，並非 GoAI 建議。
年度分割調整後的每股現金分配。
US$0.356
2025年（完整年度）+18.4% 自從 2021
2026年（部分年度）：US$0.4047
US$0.3006
2,021
US$0.4672
2,022
US$0.5628
2,023
US$0.3162
2,024
US$0.356
2,025
US$0.4047
2,026*
* 在現有股息歷史記錄中，該日曆年僅包含部分期間。
| 行動 | 除息日 | 詳情 | 記錄日期 | 付款日期 |
|---|---|---|---|---|
股息 | 2026年7月6日 | US$0.4047Annual | 2026年7月6日 | 2026年8月7日 |
股息 | 2025年7月2日 | US$0.356Annual | 2025年7月2日 | 2025年8月6日 |
股息 | 2024年7月2日 | US$0.3162Annual | 2024年7月2日 | 2024年8月5日 |
股息 | 2023年6月30日 | US$0.5628Annual | 2023年7月3日 | 2023年8月3日 |
股息 | 2022年6月29日 | US$0.4672Annual | 2022年6月30日 | 2022年8月4日 |
股息 | 2021年9月3日 | US$0.3006Annual | 2021年9月7日 | 2021年10月7日 |
除息 2026年7月6日
US$0.4047
Annual
2026年7月6日登記 · 支付日 2026年8月7日
除息 2025年7月2日
US$0.356
Annual
2025年7月2日登記 · 支付日 2025年8月6日
除息 2024年7月2日
US$0.3162
Annual
2024年7月2日登記 · 支付日 2024年8月5日
除息 2023年6月30日
US$0.5628
Annual
2023年7月3日登記 · 支付日 2023年8月3日
除息 2022年6月29日
US$0.4672
Annual
2022年6月30日登記 · 支付日 2022年8月4日
除息 2021年9月3日
US$0.3006
Annual
2021年9月7日登記 · 支付日 2021年10月7日
報告持有此股票曝險的交易所交易基金。
iShares Semiconductor ETFSOXX4.43億0.99%459.07億 USD0.33%US$536.75-1.49%
Avantis Emerging Markets Equity ETFAVEM1.72億0.61%281.39億 USD0.33%US$92.655-0.66%
Direxion Daily Semiconductor Bull 3X ETFSOXL1.43億0.65%218.47億 USD0.91%US$122.6-4.52%
YieldMax Semiconductor Portfolio Option Income ETFCHPY6290.06萬4.68%13.5億 USD1.03%US$65.65-1.43%
Amplify CWP International Enhanced Dividend Income ETFIDVO4496.24萬3.14%14.33億 USD0.65%US$41.62+0.12%
Dimensional - Emerging Core Equity Market ETFDFAE3125.1萬0.31%100.47億 USD0.29%US$38.835-0.58%
Avantis Emerging Markets Value ETFAVES2726.14萬1.74%15.61億 USD0.36%US$65.30-0.02%
Dimensional - Emerging Markets Value ETFDFEV1904.06萬0.87%21.8億 USD0.46%US$42.15-0.35%iShares Semiconductor ETFSOXXAvantis Emerging Markets Equity ETFAVEMDirexion Daily Semiconductor Bull 3X ETFSOXLYieldMax Semiconductor Portfolio Option Income ETFCHPYAmplify CWP International Enhanced Dividend Income ETFIDVODimensional - Emerging Core Equity Market ETFDFAEAvantis Emerging Markets Value ETFAVESDimensional - Emerging Markets Value ETFDFEVAI 生成內容及延遲市場資料僅供資訊與教育用途，不構成投資建議。
