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TESEC Corporation is a global entity dedicated to the engineering, manufacturing, and sale of advanced semiconductor testing equipment, serving both Japanese and international markets. The company's product range includes a variety of sophisticated test systems designed for discrete devices, thermal resistance evaluation, inductive load analysis, dynamic performance assessment, and integrated passive device/power module (IPD/IPM) applications. Furthermore, TESEC supplies a comprehensive selection of handlers, such as those for Micro Electro Mechanical Systems (MEMS), film frame testing, gravity-based operations, and Tape Automated Bonding (TAB), in addition to automated die sorters. Beyond equipment, they provide extensive after-sales support, offering services like calibration, comprehensive overhauls, technical training, spare parts provision, warranty coverage, ongoing maintenance, and equipment resale. Established in 1969, the company initially operated as TES Corporation before being renamed TESEC Corporation in 1980, and its primary headquarters are located in Tokyo, Japan.
最新数据
JP¥3,475
−JP¥370 · -9.62%
盘中时间采用JST。市场数据可能有所延迟。
TESEC Corporation is a global entity dedicated to the engineering, manufacturing, and sale of advanced semiconductor testing equipment, serving both Japanese and international markets. The company's product range includes a variety of sophisticated test systems designed for discrete devices, thermal resistance evaluation, inductive load analysis, dynamic performance assessment, and integrated passive device/power module (IPD/IPM) applications. Furthermore, TESEC supplies a comprehensive selection of handlers, such as those for Micro Electro Mechanical Systems (MEMS), film frame testing, gravity-based operations, and Tape Automated Bonding (TAB), in addition to automated die sorters. Beyond equipment, they provide extensive after-sales support, offering services like calibration, comprehensive overhauls, technical training, spare parts provision, warranty coverage, ongoing maintenance, and equipment resale. Established in 1969, the company initially operated as TES Corporation before being renamed TESEC Corporation in 1980, and its primary headquarters are located in Tokyo, Japan.
日内区间
当前JP¥3,475
52周区间
当前JP¥3,475
盘中时间采用JST。市场数据可能有所延迟。
TESEC Corporation is a global entity dedicated to the engineering, manufacturing, and sale of advanced semiconductor testing equipment, serving both Japanese and international markets. The company's product range includes a variety of sophisticated test systems designed for discrete devices, thermal resistance evaluation, inductive load analysis, dynamic performance assessment, and integrated passive device/power module (IPD/IPM) applications. Furthermore, TESEC supplies a comprehensive selection of handlers, such as those for Micro Electro Mechanical Systems (MEMS), film frame testing, gravity-based operations, and Tape Automated Bonding (TAB), in addition to automated die sorters. Beyond equipment, they provide extensive after-sales support, offering services like calibration, comprehensive overhauls, technical training, spare parts provision, warranty coverage, ongoing maintenance, and equipment resale. Established in 1969, the company initially operated as TES Corporation before being renamed TESEC Corporation in 1980, and its primary headquarters are located in Tokyo, Japan.
日内区间
当前JP¥3,475
52周区间
当前JP¥3,475
盈利能力占已公布营收的百分比。
营收
营业利润
净利润
| 项目（JPY） | 2025财年 | 2024财年 | 2023财年 | 2022财年 | 2021财年 |
|---|---|---|---|---|---|
| 营收 | 55.67亿 JPY | 58.92亿 JPY | 86.19亿 JPY | 87.43亿 JPY | 75.12亿 JPY |
| 销货成本 | 34.21亿 JPY | 36.56亿 JPY | 48.12亿 JPY | 46.71亿 JPY | 41.8亿 JPY |
| 毛利 | 21.46亿 JPY | 22.36亿 JPY | 38.07亿 JPY | 40.72亿 JPY | 33.32亿 JPY |
| 研究与开发 | 3.53亿 JPY | 3.37亿 JPY | 4.25亿 JPY | 3.48亿 JPY | 2.4亿 JPY |
| 销售、一般及管理费用 | 14.92亿 JPY | 14.58亿 JPY | 16.51亿 JPY | 15.31亿 JPY | 13.43亿 JPY |
| 营业费用 | 18.45亿 JPY | 17.96亿 JPY | 20.76亿 JPY | 19.38亿 JPY | 15.83亿 JPY |
| 利息收入 | 9200万 JPY | 7700万 JPY | 6300万 JPY | 7700万 JPY | 2900万 JPY |
| 利息支出 | 600万 JPY | 100万 JPY | — | — | — |
| 折旧和摊销 | 1.19亿 JPY | 1.17亿 JPY | 6700万 JPY | 6500万 JPY | 5200万 JPY |
| 营业利润 | 3.01亿 JPY | 4.4亿 JPY | 17.31亿 JPY | 21.34亿 JPY | 17.49亿 JPY |
| 净利润 | 4.63亿 JPY | 4.27亿 JPY | 15.15亿 JPY | 22.55亿 JPY | 17.22亿 JPY |
公司数据更新于 2026年10月15日。
近期已公布业绩
近期已公布业绩
AI 生成内容及延迟市场数据仅供信息与教育用途，不构成投资建议。
