CEVA, Inc. is a global provider of intellectual property (IP) for advanced wireless connectivity and intelligent sensing solutions, serving semiconductor manufacturers and original equipment manufacturers (OEMs). The company specializes in developing and licensing a broad range of digital signal processors (DSPs), AI accelerators, wireless communication platforms, and complementary software. These offerings are engineered to support applications such as sensor data integration, image enhancement, machine vision, voice command processing, and artificial intelligence. CEVA's extensive IP portfolio features DSP-driven platforms for 5G baseband processing in mobile, IoT, and infrastructure environments, alongside sophisticated imaging and computer vision capabilities for all camera-enabled devices. They also offer ultra-low power audio, voice, and speech processing, including always-on sensing functionalities for a wide spectrum of IoT markets. Furthermore, their solutions include sensor fusion software and Inertial Measurement Unit (IMU) technologies, specifically designed for hearables, wearables, augmented/virtual reality (AR/VR) systems, personal computers, robotics, remote controls, and other IoT applications. The company also provides comprehensive wireless IoT IP, encompassing standards like Bluetooth, Wi-Fi (4/5/6/6E), Ultra-wideband (UWB), and Narrowband IoT (NB-IoT). Customers integrate CEVA's technologies into their Application-Specific Integrated Circuits (ASICs) and Application-Specific Standard Products (ASSPs). These ultimately enable a vast array of end products across the mobile, consumer, automotive, robotics, industrial, aerospace and defense, and broader Internet of Things (IoT) sectors. CEVA delivers its DSP cores, platforms, and AI processors as hardware description language (HDL) definitions. To facilitate partner development, the company also provides essential development platforms, software development kits (SDKs), and debugging tools, which streamline system design and software integration. Technology licensing is handled through a direct sales force. Incorporated in 1999 and formerly known as ParthusCeva, Inc. until its rebranding in December 2003, CEVA, Inc. is headquartered in Rockville, Maryland.
前收盤價
US$33.49
−US$0.17 · -0.51%
盤中時間採用ET。市場資料可能有所延遲。
CEVA, Inc. is a global provider of intellectual property (IP) for advanced wireless connectivity and intelligent sensing solutions, serving semiconductor manufacturers and original equipment manufacturers (OEMs). The company specializes in developing and licensing a broad range of digital signal processors (DSPs), AI accelerators, wireless communication platforms, and complementary software. These offerings are engineered to support applications such as sensor data integration, image enhancement, machine vision, voice command processing, and artificial intelligence. CEVA's extensive IP portfolio features DSP-driven platforms for 5G baseband processing in mobile, IoT, and infrastructure environments, alongside sophisticated imaging and computer vision capabilities for all camera-enabled devices. They also offer ultra-low power audio, voice, and speech processing, including always-on sensing functionalities for a wide spectrum of IoT markets. Furthermore, their solutions include sensor fusion software and Inertial Measurement Unit (IMU) technologies, specifically designed for hearables, wearables, augmented/virtual reality (AR/VR) systems, personal computers, robotics, remote controls, and other IoT applications. The company also provides comprehensive wireless IoT IP, encompassing standards like Bluetooth, Wi-Fi (4/5/6/6E), Ultra-wideband (UWB), and Narrowband IoT (NB-IoT). Customers integrate CEVA's technologies into their Application-Specific Integrated Circuits (ASICs) and Application-Specific Standard Products (ASSPs). These ultimately enable a vast array of end products across the mobile, consumer, automotive, robotics, industrial, aerospace and defense, and broader Internet of Things (IoT) sectors. CEVA delivers its DSP cores, platforms, and AI processors as hardware description language (HDL) definitions. To facilitate partner development, the company also provides essential development platforms, software development kits (SDKs), and debugging tools, which streamline system design and software integration. Technology licensing is handled through a direct sales force. Incorporated in 1999 and formerly known as ParthusCeva, Inc. until its rebranding in December 2003, CEVA, Inc. is headquartered in Rockville, Maryland.
日內區間
目前US$33.49
52週區間
目前US$33.49
盤中時間採用ET。市場資料可能有所延遲。
CEVA, Inc. is a global provider of intellectual property (IP) for advanced wireless connectivity and intelligent sensing solutions, serving semiconductor manufacturers and original equipment manufacturers (OEMs). The company specializes in developing and licensing a broad range of digital signal processors (DSPs), AI accelerators, wireless communication platforms, and complementary software. These offerings are engineered to support applications such as sensor data integration, image enhancement, machine vision, voice command processing, and artificial intelligence. CEVA's extensive IP portfolio features DSP-driven platforms for 5G baseband processing in mobile, IoT, and infrastructure environments, alongside sophisticated imaging and computer vision capabilities for all camera-enabled devices. They also offer ultra-low power audio, voice, and speech processing, including always-on sensing functionalities for a wide spectrum of IoT markets. Furthermore, their solutions include sensor fusion software and Inertial Measurement Unit (IMU) technologies, specifically designed for hearables, wearables, augmented/virtual reality (AR/VR) systems, personal computers, robotics, remote controls, and other IoT applications. The company also provides comprehensive wireless IoT IP, encompassing standards like Bluetooth, Wi-Fi (4/5/6/6E), Ultra-wideband (UWB), and Narrowband IoT (NB-IoT). Customers integrate CEVA's technologies into their Application-Specific Integrated Circuits (ASICs) and Application-Specific Standard Products (ASSPs). These ultimately enable a vast array of end products across the mobile, consumer, automotive, robotics, industrial, aerospace and defense, and broader Internet of Things (IoT) sectors. CEVA delivers its DSP cores, platforms, and AI processors as hardware description language (HDL) definitions. To facilitate partner development, the company also provides essential development platforms, software development kits (SDKs), and debugging tools, which streamline system design and software integration. Technology licensing is handled through a direct sales force. Incorporated in 1999 and formerly known as ParthusCeva, Inc. until its rebranding in December 2003, CEVA, Inc. is headquartered in Rockville, Maryland.
日內區間
目前US$33.49
52週區間
目前US$33.49
獲利能力占已公布營收的百分比。
營收
營業利益
淨利
| 項目(USD) | 2025會計年度 | 2024會計年度 | 2023會計年度 | 2022會計年度 | 2021會計年度 |
|---|---|---|---|---|---|
| 營收 | 1.1億 USD | 1.07億 USD | 9741.9萬 USD | 1.21億 USD | 1.14億 USD |
| 銷貨成本 | 1415.8萬 USD | 1276.8萬 USD | 1164.8萬 USD | 1513.1萬 USD | 1037.8萬 USD |
| 毛利 | 9544萬 USD | 9417.1萬 USD | 8577.1萬 USD | 1.05億 USD | 1.03億 USD |
| 研究與開發 | 7483.3萬 USD | 7161.6萬 USD | 7268.9萬 USD | 7031.7萬 USD | 6908.9萬 USD |
| 銷售、一般及管理費用 | 3135.5萬 USD | 2950.1萬 USD | 2595.5萬 USD | 2565.8萬 USD | 2502.3萬 USD |
| 營業費用 | 1.07億 USD | 1.02億 USD | 9923.8萬 USD | 1.02億 USD | 9641.4萬 USD |
| 利息收入 | 691.3萬 USD | 587.6萬 USD | 448.6萬 USD | 319萬 USD | 187.3萬 USD |
| 利息支出 | — | — | — | 39.7萬 USD | 42萬 USD |
| 折舊和攤銷 | 413.6萬 USD | 413.6萬 USD | 488.3萬 USD | 756.1萬 USD | 698.5萬 USD |
| 營業利益 | −1134.6萬 USD | −754.5萬 USD | −1346.7萬 USD | 389.6萬 USD | 704萬 USD |
| 淨利 | −1063.8萬 USD | −878.6萬 USD | −1187.8萬 USD | −2318.3萬 USD | 39.6萬 USD |
公司資料更新於 2026年10月11日。
近期已公布業績
近期已公布業績
第三方分析師預期可能變動,並非 GoAI 建議。
平均目標
US$46.20
上漲空間 37.95%| 行動 | 生效日期 | 詳情 | 記錄日期 | 付款日期 |
|---|---|---|---|---|
股票分割 | 2002年11月1日 | 10:319 | — | — |
已生效 2002年11月1日
10:319
報告持有此股票曝險的交易所交易基金。
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