読み込み中
Founded in 1969 and headquartered in Amagasaki, Japan, MEC Company Ltd. specializes in the research, development, manufacturing, and distribution of chemicals, equipment, and materials crucial for printed circuit board (PCB) production across Asian and European markets. Its comprehensive chemical portfolio addresses various critical steps in PCB fabrication. This includes diverse solutions for adhesion enhancement, such as roughening treatments for different substrate types (e.g., rolled copper, multilayer materials) and high-frequency applications, as well as copper surface preparation for CO2 laser direct drilling, and pretreatments for dry films and solder masks. The company also supplies chemicals for microetching, etch down, anisotropic etching, copper seed layer etching, and other general metal surface treatments. Additionally, MEC provides solutions for residue removal, degreasing, rust prevention, temporary anti-tarnish, metal resist stripping, and HALS. A significant offering is AMALPHA, an advanced metal surface treatment technology designed to enable direct bonding between metals and resins.
最新データ
￥7,520
+￥320 · +4.44%
日中の時刻はJSTです。市場データは遅延する場合があります。
Founded in 1969 and headquartered in Amagasaki, Japan, MEC Company Ltd. specializes in the research, development, manufacturing, and distribution of chemicals, equipment, and materials crucial for printed circuit board (PCB) production across Asian and European markets. Its comprehensive chemical portfolio addresses various critical steps in PCB fabrication. This includes diverse solutions for adhesion enhancement, such as roughening treatments for different substrate types (e.g., rolled copper, multilayer materials) and high-frequency applications, as well as copper surface preparation for CO2 laser direct drilling, and pretreatments for dry films and solder masks. The company also supplies chemicals for microetching, etch down, anisotropic etching, copper seed layer etching, and other general metal surface treatments. Additionally, MEC provides solutions for residue removal, degreasing, rust prevention, temporary anti-tarnish, metal resist stripping, and HALS. A significant offering is AMALPHA, an advanced metal surface treatment technology designed to enable direct bonding between metals and resins.
日中レンジ
現在 ￥7,520
52週レンジ
現在 ￥7,520
日中の時刻はJSTです。市場データは遅延する場合があります。
Founded in 1969 and headquartered in Amagasaki, Japan, MEC Company Ltd. specializes in the research, development, manufacturing, and distribution of chemicals, equipment, and materials crucial for printed circuit board (PCB) production across Asian and European markets. Its comprehensive chemical portfolio addresses various critical steps in PCB fabrication. This includes diverse solutions for adhesion enhancement, such as roughening treatments for different substrate types (e.g., rolled copper, multilayer materials) and high-frequency applications, as well as copper surface preparation for CO2 laser direct drilling, and pretreatments for dry films and solder masks. The company also supplies chemicals for microetching, etch down, anisotropic etching, copper seed layer etching, and other general metal surface treatments. Additionally, MEC provides solutions for residue removal, degreasing, rust prevention, temporary anti-tarnish, metal resist stripping, and HALS. A significant offering is AMALPHA, an advanced metal surface treatment technology designed to enable direct bonding between metals and resins.
日中レンジ
現在 ￥7,520
52週レンジ
現在 ￥7,520
利用可能な期間全体で報告されたマージン。
売上高
営業利益
純利益
| 指標（JPY） | 2025年度 | 2024年度 | 2023年度 | 2022年度 | 2021年度 |
|---|---|---|---|---|---|
| 売上高 | 209.48億 JPY | 182.34億 JPY | 140.2億 JPY | 163.29億 JPY | 150.38億 JPY |
| 売上原価 | 79.71億 JPY | 71.33億 JPY | 57.03億 JPY | 65.25億 JPY | 57.15億 JPY |
| 粗利益 | 129.77億 JPY | 111.02億 JPY | 83.17億 JPY | 98.04億 JPY | 93.23億 JPY |
| 研究開発 | 13.79億 JPY | 13.34億 JPY | 12.19億 JPY | 13.3億 JPY | 13.24億 JPY |
| 販売・一般管理 | 58.5億 JPY | 52.05億 JPY | 46.05億 JPY | 44.69億 JPY | 40.6億 JPY |
| 営業費用 | 72.29億 JPY | 65.39億 JPY | 58.24億 JPY | 57.99億 JPY | 53.83億 JPY |
| 受取利息 | 3017万 JPY | 5655.1万 JPY | 5338.8万 JPY | 2894.4万 JPY | 2866.5万 JPY |
| 支払利息 | 625.1万 JPY | 117.9万 JPY | 51万 JPY | 69.9万 JPY | 84.2万 JPY |
| 減価償却費と償却費 | 8.23億 JPY | 8.16億 JPY | 7.73億 JPY | 7.6億 JPY | 7.42億 JPY |
| 営業利益 | 57.48億 JPY | 45.62億 JPY | 24.93億 JPY | 40.04億 JPY | 39.4億 JPY |
| 純利益 | 50.29億 JPY | 22.92億 JPY | 23.05億 JPY | 30.65億 JPY | 29.49億 JPY |
会社概要が更新されました 2026年10月5日.
直近の発表実績
直近の発表実績
この株式へのエクスポージャーを報告している上場投資信託です。
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