ChipMOS TECHNOLOGIES INC. conducts research, development, manufacturing, and global sales of advanced, highly integrated, and precise integrated circuits. Headquartered in Hsinchu, Taiwan, and founded in 1997, the company also provides essential back-end assembly and testing services across key international markets, including Taiwan, mainland China, Japan, and Singapore. Its operations are structured across various segments, encompassing Testing, Assembly, Bumping, and specialized Testing and Assembly for LCD, OLED, and other display panel driver semiconductors, in addition to other related business areas. ChipMOS offers a comprehensive suite of back-end services: for memory and logic/mixed-signal semiconductors, these include engineering tests, wafer probing, final testing, and package assembly utilizing leadframe and organic substrate technologies. For display panel driver semiconductors, such as those used in LCDs and OLEDs, the company delivers gold bumping, reel-to-reel assembly, and testing solutions. The integrated circuits and services provided by ChipMOS are integral to a wide array of products, spanning personal computers, graphics applications like game consoles, telecommunications equipment, mobile devices including cellular phones, tablets, and various consumer electronics, as well as automotive, industrial, and display panel sectors.
前日終値
$77.73
+$2.23 · +2.95%
日中の時刻はETです。市場データは遅延する場合があります。
ChipMOS TECHNOLOGIES INC. conducts research, development, manufacturing, and global sales of advanced, highly integrated, and precise integrated circuits. Headquartered in Hsinchu, Taiwan, and founded in 1997, the company also provides essential back-end assembly and testing services across key international markets, including Taiwan, mainland China, Japan, and Singapore. Its operations are structured across various segments, encompassing Testing, Assembly, Bumping, and specialized Testing and Assembly for LCD, OLED, and other display panel driver semiconductors, in addition to other related business areas. ChipMOS offers a comprehensive suite of back-end services: for memory and logic/mixed-signal semiconductors, these include engineering tests, wafer probing, final testing, and package assembly utilizing leadframe and organic substrate technologies. For display panel driver semiconductors, such as those used in LCDs and OLEDs, the company delivers gold bumping, reel-to-reel assembly, and testing solutions. The integrated circuits and services provided by ChipMOS are integral to a wide array of products, spanning personal computers, graphics applications like game consoles, telecommunications equipment, mobile devices including cellular phones, tablets, and various consumer electronics, as well as automotive, industrial, and display panel sectors.
日中レンジ
現在 $77.73
52週レンジ
現在 $77.73
日中の時刻はETです。市場データは遅延する場合があります。
GoAI スコア
中立
バリュエーション
48
適正価値
センチメント
59
まちまち
リスク
48
やや高いリスク
モメンタム
93
強い上昇
GoAIの詳細リサーチ
詳しい根拠、カタリスト、リスクを確認できます。
ChipMOS TECHNOLOGIES INC. conducts research, development, manufacturing, and global sales of advanced, highly integrated, and precise integrated circuits. Headquartered in Hsinchu, Taiwan, and founded in 1997, the company also provides essential back-end assembly and testing services across key international markets, including Taiwan, mainland China, Japan, and Singapore. Its operations are structured across various segments, encompassing Testing, Assembly, Bumping, and specialized Testing and Assembly for LCD, OLED, and other display panel driver semiconductors, in addition to other related business areas. ChipMOS offers a comprehensive suite of back-end services: for memory and logic/mixed-signal semiconductors, these include engineering tests, wafer probing, final testing, and package assembly utilizing leadframe and organic substrate technologies. For display panel driver semiconductors, such as those used in LCDs and OLEDs, the company delivers gold bumping, reel-to-reel assembly, and testing solutions. The integrated circuits and services provided by ChipMOS are integral to a wide array of products, spanning personal computers, graphics applications like game consoles, telecommunications equipment, mobile devices including cellular phones, tablets, and various consumer electronics, as well as automotive, industrial, and display panel sectors.
日中レンジ
現在 $77.73
52週レンジ
現在 $77.73
利用可能な期間全体で報告されたマージン。
売上高
営業利益
純利益
| 指標(TWD) | 2025年度 | 2024年度 | 2023年度 | 2022年度 | 2021年度 |
|---|---|---|---|---|---|
| 売上高 | 240.64億 TWD | 226.96億 TWD | 213.56億 TWD | 235.17億 TWD | 274億 TWD |
| 売上原価 | 214.57億 TWD | 197.52億 TWD | 178.07億 TWD | 186.05億 TWD | 201.46億 TWD |
| 粗利益 | 26.07億 TWD | 29.44億 TWD | 35.49億 TWD | 49.12億 TWD | 72.54億 TWD |
| 研究開発 | 10.83億 TWD | 11.63億 TWD | 10.94億 TWD | 11.59億 TWD | 11.39億 TWD |
| 販売・一般管理 | 6.11億 TWD | 6.07億 TWD | 6.33億 TWD | 6.67億 TWD | 6.78億 TWD |
| 営業費用 | 16.98億 TWD | 16.7億 TWD | 16.41億 TWD | 16.95億 TWD | 16.92億 TWD |
| 受取利息 | 2.45億 TWD | 1.98億 TWD | 1.93億 TWD | 5719.9万 TWD | 998万 TWD |
| 支払利息 | 3.03億 TWD | 2.79億 TWD | 2.66億 TWD | 1.42億 TWD | 1.31億 TWD |
| 減価償却費と償却費 | 51.29億 TWD | 48.56億 TWD | 47.79億 TWD | 47.52億 TWD | 46.34億 TWD |
| 営業利益 | 9.09億 TWD | 12.74億 TWD | 19.08億 TWD | 32.17億 TWD | 55.62億 TWD |
| 純利益 | 4.98億 TWD | 14.4億 TWD | 19.68億 TWD | 34.4億 TWD | 49.37億 TWD |
会社概要が更新されました 2026年10月11日.
直近の発表実績
直近の発表実績
| 種別 | 発効日 | 詳細 | 基準日 | 支払日 |
|---|---|---|---|---|
株式分割 | 2018年11月2日 | 17:20 | — | — |
株式分割 | 2016年10月31日 | 2,000:1,871 | — | — |
株式分割 | 2011年1月24日 | 1:4 | — | — |
発効済み 2018年11月2日
17:20
発効済み 2016年10月31日
2,000:1,871
発効済み 2011年1月24日
1:4
この株式へのエクスポージャーを報告している上場投資信託です。
Dimensional World ex U.S. Core Equity 2 ETFDFAX50.29万0.00%123.36億 USD0.28%$37.08+0.76%
ActivePassive International Equity ETFAPIE49.68万0.04%11.41億 USD0.45%$38.56+0.65%
Dimensional - Emerging Core Equity Market ETFDFAE21万0.00%101.12億 USD0.29%$39.40+0.97%
Invesco NASDAQ Future Gen 200 ETFQQQS17.05万0.75%2275.83万 USD0.20%$42.145+1.39%
Dimensional - Emerging Markets ex China Core Equity ETFDEXC2.4万0.01%2.99億 USD0.56%$80.0833+0.98%
REX AI Chipmaking ETFCHIP2.22万1.40%78.9万 USD0.65%$26.67+1.42%
Dimensional - Emerging Markets Value ETFDFEV1.6万0.00%21.87億 USD0.46%$42.58+1.00%
Dimensional World ex U.S. Core Equity 2 ETFDFAX
ActivePassive International Equity ETFAPIE
Dimensional - Emerging Core Equity Market ETFDFAE
Invesco NASDAQ Future Gen 200 ETFQQQS
Dimensional - Emerging Markets ex China Core Equity ETFDEXC
REX AI Chipmaking ETFCHIP
Dimensional - Emerging Markets Value ETFDFEVAIが生成した遅延市場データを、情報提供および教育目的で掲載しています。投資助言ではありません。