Micron Started Building the First HBM Advanced Packaging Plant in Singapore, Strengthening Singapore Semiconductor's Manufacturing Ability

On Wednesday (Jan. 8), Micron Technology $MU started establishing a high-bandwidth memory (HBM) advanced packaging factory in Singapore, the first of its kind in the country.

Micron Technology‘s new HBM packaging plant is adjacent to the company's current plant in Singapore. Gan Kim Yong, Deputy Prime Minister and Minister for Trade and Industry of Singapore, Png Cheong Boon, Chairman of the Singapore Economic Development Board, and Pee Beng Kong, Executive Vice President of the Singapore Economic Development Board attended Micron's groundbreaking ceremony.

The new facility is scheduled to operate in 2026 and enhance Micron's total advanced packaging capacity in 2027 to satisfy the growing need for AI. The facility can nourish the local semiconductor ecosystem in Singapore.

Sanjay Mehrotra, Micron's president and chief executive officer, said demand for advanced memory and storage solutions has grown with the surge in AI usage. With the continued support of Singapore's government, Micron's HBM packaging facility in Singapore will meet expanding AI demands.

Png Cheong Boon, Chairman of the Singapore Economic Development Board, said Singapore supports Micron because it has confidence in Singapore's competitiveness becoming a key hub in the global semiconductor supply chain. The plant is Singapore's first HBM advanced packaging facility, enabling Singapore to assist global AI growth. Micron's investment will improve Singapore's semiconductor ecosystem.

Micron's long-term HBM advanced packaging investment is approximately $7 billion. The plant will create approximately 1,400 jobs, with plans to expand to approximately 3,000 jobs. The job range covers package development, assembly, and test operations. Micron's expansion plans in Singapore will also include NAND manufacturing and the development of the HBM and NAND facilities.

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