Disco Corporation

Established in Tokyo in 1937, Disco Corporation is a leading global manufacturer and distributor of high-precision equipment for cutting, grinding, and polishing. Its extensive catalog of precision machinery encompasses dicing and laser saws, grinders, polishers, wafer mounters, die separators, surface planers, and waterjet saws, in addition to specialized solutions for pre-grinding dicing and package singulation. The company also provides critical processing consumables, such as dicing blades, grinding wheels, and dry polishing wheels, along with ancillary equipment, frames, cassettes, and additives for cutting fluids. Disco's offerings extend beyond manufacturing to include machine dismantling and recycling services, operational and maintenance training for its products, and the leasing and resale of pre-owned precision machinery.

業界

Semiconductors

セクター

Technology

本社

JP

最高経営責任者（CEO）

Kazuma Sekiya

上場以来

2001年1月1日

従業員

5,547