
JPXBasic MaterialsChemicals - Specialty
Latest quote
¥6,250
−¥10.00 · -0.16%
Founded in 1969 and headquartered in Amagasaki, Japan, MEC Company Ltd. specializes in the research, development, manufacturing, and distribution of chemicals, equipment, and materials crucial for printed circuit board (PCB) production across Asian and European markets. Its comprehensive chemical portfolio addresses various critical steps in PCB fabrication. This includes diverse solutions for adhesion enhancement, such as roughening treatments for different substrate types (e.g., rolled copper, multilayer materials) and high-frequency applications, as well as copper surface preparation for CO2 laser direct drilling, and pretreatments for dry films and solder masks. The company also supplies chemicals for microetching, etch down, anisotropic etching, copper seed layer etching, and other general metal surface treatments. Additionally, MEC provides solutions for residue removal, degreasing, rust prevention, temporary anti-tarnish, metal resist stripping, and HALS. A significant offering is AMALPHA, an advanced metal surface treatment technology designed to enable direct bonding between metals and resins.
Latest quote
¥6,250
−¥10.00 · -0.16%
Regular session · JST · Market data may be delayed.
Founded in 1969 and headquartered in Amagasaki, Japan, MEC Company Ltd. specializes in the research, development, manufacturing, and distribution of chemicals, equipment, and materials crucial for printed circuit board (PCB) production across Asian and European markets. Its comprehensive chemical portfolio addresses various critical steps in PCB fabrication. This includes diverse solutions for adhesion enhancement, such as roughening treatments for different substrate types (e.g., rolled copper, multilayer materials) and high-frequency applications, as well as copper surface preparation for CO2 laser direct drilling, and pretreatments for dry films and solder masks. The company also supplies chemicals for microetching, etch down, anisotropic etching, copper seed layer etching, and other general metal surface treatments. Additionally, MEC provides solutions for residue removal, degreasing, rust prevention, temporary anti-tarnish, metal resist stripping, and HALS. A significant offering is AMALPHA, an advanced metal surface treatment technology designed to enable direct bonding between metals and resins.
Day range
Current ¥6,250
52-week range
Current ¥6,250
Regular session · JST · Market data may be delayed.
Founded in 1969 and headquartered in Amagasaki, Japan, MEC Company Ltd. specializes in the research, development, manufacturing, and distribution of chemicals, equipment, and materials crucial for printed circuit board (PCB) production across Asian and European markets. Its comprehensive chemical portfolio addresses various critical steps in PCB fabrication. This includes diverse solutions for adhesion enhancement, such as roughening treatments for different substrate types (e.g., rolled copper, multilayer materials) and high-frequency applications, as well as copper surface preparation for CO2 laser direct drilling, and pretreatments for dry films and solder masks. The company also supplies chemicals for microetching, etch down, anisotropic etching, copper seed layer etching, and other general metal surface treatments. Additionally, MEC provides solutions for residue removal, degreasing, rust prevention, temporary anti-tarnish, metal resist stripping, and HALS. A significant offering is AMALPHA, an advanced metal surface treatment technology designed to enable direct bonding between metals and resins.
Day range
Current ¥6,250
52-week range
Current ¥6,250
Profitability as a percentage of reported revenue.
Revenue
Operating income
Net income
| Metric (JPY) | FY2025 | FY2024 | FY2023 | FY2022 | FY2021 |
|---|---|---|---|---|---|
| Revenue | 20.95B JPY | 18.23B JPY | 14.02B JPY | 16.33B JPY | 15.04B JPY |
| Cost of goods sold | 7.97B JPY | 7.13B JPY | 5.7B JPY | 6.53B JPY | 5.72B JPY |
| Gross profit | 12.98B JPY | 11.1B JPY | 8.32B JPY | 9.8B JPY | 9.32B JPY |
| Research and development | 1.38B JPY | 1.33B JPY | 1.22B JPY | 1.33B JPY | 1.32B JPY |
| Selling, general, and administrative | 5.85B JPY | 5.21B JPY | 4.6B JPY | 4.47B JPY | 4.06B JPY |
| Operating expenses | 7.23B JPY | 6.54B JPY | 5.82B JPY | 5.8B JPY | 5.38B JPY |
| Interest income | 30.17M JPY | 56.55M JPY | 53.39M JPY | 28.94M JPY | 28.67M JPY |
| Interest expense | 6.25M JPY | 1.18M JPY | 510K JPY | 699K JPY | 842K JPY |
| Depreciation and amortization | 823.46M JPY | 816.01M JPY | 773.43M JPY | 759.59M JPY | 742.05M JPY |
| Operating income | 5.75B JPY | 4.56B JPY | 2.49B JPY | 4B JPY | 3.94B JPY |
| Net income | 5.03B JPY | 2.29B JPY | 2.3B JPY | 3.06B JPY | 2.95B JPY |
Company facts updated Sep 6, 2026.
Recent quarterly results
Recent quarterly results
Cash distributions grouped by calendar year; partial years are marked.
¥96.00
2025 complete year+174.3% since 2021
2026 partial: ¥55.00
¥35.00
2,021
¥45.00
2,022
¥45.00
2,023
¥45.00
2,024
¥96.00
2,025
¥55.00
2,026*
* Partial calendar year in the available dividend history.
| Action | Ex-dividend date | Details | Record date | Payment date |
|---|---|---|---|---|
DividendUpcoming | Dec 29, 2026 | ¥55.00Semi-Annual | Dec 31, 2026 | Dec 29, 2026 |
Dividend | Jun 29, 2026 | ¥55.00Semi-Annual | Jun 30, 2026 | Sep 1, 2026 |
Dividend | Dec 29, 2025 | ¥71.00Semi-Annual | Dec 31, 2025 | Mar 4, 2026 |
Dividend | Jun 27, 2025 | ¥25.00Semi-Annual | Jun 30, 2025 | Sep 2, 2025 |
Dividend | Dec 27, 2024 | ¥25.00Semi-Annual | Dec 31, 2024 | Mar 4, 2025 |
Dividend | Jun 27, 2024 | ¥20.00Semi-Annual | Jun 30, 2024 | Sep 3, 2024 |
Ex-dividend Dec 29, 2026
¥55.00
Semi-Annual
Record Dec 31, 2026 · Payment Dec 29, 2026
Ex-dividend Jun 29, 2026
¥55.00
Semi-Annual
Record Jun 30, 2026 · Payment Sep 1, 2026
Ex-dividend Dec 29, 2025
¥71.00
Semi-Annual
Record Dec 31, 2025 · Payment Mar 4, 2026
Ex-dividend Jun 27, 2025
¥25.00
Semi-Annual
Record Jun 30, 2025 · Payment Sep 2, 2025
Ex-dividend Dec 27, 2024
¥25.00
Semi-Annual
Record Dec 31, 2024 · Payment Mar 4, 2025
Ex-dividend Jun 27, 2024
¥20.00
Semi-Annual
Record Jun 30, 2024 · Payment Sep 3, 2024
Funds reporting this stock among their holdings, ordered by reported position size.
iShares Core TOPIX ETF1475.T271.51M0.01%2.9T JPY0.05%¥421.6+0.12%
Vanguard Total International Stock ETFVXUS11.18M0.00%646.2B USD0.05%$88.41+0.50%
Vanguard FTSE Developed Markets ETFVEA7.44M0.00%315B USD0.03%$73.76+0.44%
iShares Core MSCI EAFE ETFIEFA4.02M0.00%193.86B USD0.07%$101.08+0.13%
Vanguard FTSE All-World ex-US Small-Cap ETFVSS2.89M0.02%13.6B USD0.06%$161.34+0.42%
Dimensional - International Small Cap ETFDFIS2.71M0.05%5.86B USD0.39%$37.67+0.13%
iShares MSCI EAFE Small-Cap ETFSCZ2.25M0.02%13.11B USD0.40%$87.57+0.10%
Schwab International Small-Cap Equity ETFSCHC1.3M0.02%5.68B USD0.06%$51.62+0.27%
iShares Core TOPIX ETF1475.T
Vanguard Total International Stock ETFVXUS
Vanguard FTSE Developed Markets ETFVEA
iShares Core MSCI EAFE ETFIEFA
Vanguard FTSE All-World ex-US Small-Cap ETFVSS
Dimensional - International Small Cap ETFDFIS
iShares MSCI EAFE Small-Cap ETFSCZ
Schwab International Small-Cap Equity ETFSCHCAI-generated and delayed market data for informational and educational purposes only. Not investment advice.