Loading
TESEC Corporation is a global entity dedicated to the engineering, manufacturing, and sale of advanced semiconductor testing equipment, serving both Japanese and international markets. The company's product range includes a variety of sophisticated test systems designed for discrete devices, thermal resistance evaluation, inductive load analysis, dynamic performance assessment, and integrated passive device/power module (IPD/IPM) applications. Furthermore, TESEC supplies a comprehensive selection of handlers, such as those for Micro Electro Mechanical Systems (MEMS), film frame testing, gravity-based operations, and Tape Automated Bonding (TAB), in addition to automated die sorters. Beyond equipment, they provide extensive after-sales support, offering services like calibration, comprehensive overhauls, technical training, spare parts provision, warranty coverage, ongoing maintenance, and equipment resale. Established in 1969, the company initially operated as TES Corporation before being renamed TESEC Corporation in 1980, and its primary headquarters are located in Tokyo, Japan.
Latest quote
¥3,560
+¥200 · +5.95%
Regular session · JST · Market data may be delayed.
TESEC Corporation is a global entity dedicated to the engineering, manufacturing, and sale of advanced semiconductor testing equipment, serving both Japanese and international markets. The company's product range includes a variety of sophisticated test systems designed for discrete devices, thermal resistance evaluation, inductive load analysis, dynamic performance assessment, and integrated passive device/power module (IPD/IPM) applications. Furthermore, TESEC supplies a comprehensive selection of handlers, such as those for Micro Electro Mechanical Systems (MEMS), film frame testing, gravity-based operations, and Tape Automated Bonding (TAB), in addition to automated die sorters. Beyond equipment, they provide extensive after-sales support, offering services like calibration, comprehensive overhauls, technical training, spare parts provision, warranty coverage, ongoing maintenance, and equipment resale. Established in 1969, the company initially operated as TES Corporation before being renamed TESEC Corporation in 1980, and its primary headquarters are located in Tokyo, Japan.
Day range
Current ¥3,560
52-week range
Current ¥3,560
Regular session · JST · Market data may be delayed.
TESEC Corporation is a global entity dedicated to the engineering, manufacturing, and sale of advanced semiconductor testing equipment, serving both Japanese and international markets. The company's product range includes a variety of sophisticated test systems designed for discrete devices, thermal resistance evaluation, inductive load analysis, dynamic performance assessment, and integrated passive device/power module (IPD/IPM) applications. Furthermore, TESEC supplies a comprehensive selection of handlers, such as those for Micro Electro Mechanical Systems (MEMS), film frame testing, gravity-based operations, and Tape Automated Bonding (TAB), in addition to automated die sorters. Beyond equipment, they provide extensive after-sales support, offering services like calibration, comprehensive overhauls, technical training, spare parts provision, warranty coverage, ongoing maintenance, and equipment resale. Established in 1969, the company initially operated as TES Corporation before being renamed TESEC Corporation in 1980, and its primary headquarters are located in Tokyo, Japan.
Day range
Current ¥3,560
52-week range
Current ¥3,560
Profitability as a percentage of reported revenue.
Revenue
Operating income
Net income
| Metric (JPY) | FY2025 | FY2024 | FY2023 | FY2022 | FY2021 |
|---|---|---|---|---|---|
| Revenue | 5.57B JPY | 5.89B JPY | 8.62B JPY | 8.74B JPY | 7.51B JPY |
| Cost of goods sold | 3.42B JPY | 3.66B JPY | 4.81B JPY | 4.67B JPY | 4.18B JPY |
| Gross profit | 2.15B JPY | 2.24B JPY | 3.81B JPY | 4.07B JPY | 3.33B JPY |
| Research and development | 353M JPY | 337M JPY | 425M JPY | 348M JPY | 240M JPY |
| Selling, general, and administrative | 1.49B JPY | 1.46B JPY | 1.65B JPY | 1.53B JPY | 1.34B JPY |
| Operating expenses | 1.85B JPY | 1.8B JPY | 2.08B JPY | 1.94B JPY | 1.58B JPY |
| Interest income | 92M JPY | 77M JPY | 63M JPY | 77M JPY | 29M JPY |
| Interest expense | 6M JPY | 1M JPY | — | — | — |
| Depreciation and amortization | 119M JPY | 117M JPY | 67M JPY | 65M JPY | 52M JPY |
| Operating income | 301M JPY | 440M JPY | 1.73B JPY | 2.13B JPY | 1.75B JPY |
| Net income | 463M JPY | 427M JPY | 1.52B JPY | 2.26B JPY | 1.72B JPY |
Company facts updated Sep 6, 2026.
Recent quarterly results
Recent quarterly results
Cash distributions grouped by calendar year; partial years are marked.
¥70.00
2025 complete year+600.0% since 2021
2026 partial: ¥100
¥10.00
2,021
¥80.00
2,022
¥100
2,023
¥70.00
2,024
¥70.00
2,025
¥100
2,026*
* Partial calendar year in the available dividend history.
| Action | Ex-dividend date | Details | Record date | Payment date |
|---|---|---|---|---|
DividendUpcoming | Sep 29, 2026 | ¥50.00Semi-Annual | Sep 30, 2026 | Sep 29, 2026 |
DividendUpcoming | Mar 30, 2027 | ¥50.00Semi-Annual | Mar 31, 2027 | Mar 30, 2027 |
Dividend | Mar 30, 2026 | ¥100Annual | Mar 31, 2026 | Jun 9, 2026 |
Dividend | Mar 28, 2025 | ¥70.00Annual | Mar 31, 2025 | Jun 10, 2025 |
Dividend | Mar 28, 2024 | ¥70.00Annual | Mar 31, 2024 | Jun 11, 2024 |
Dividend | Mar 30, 2023 | ¥100Annual | Mar 31, 2023 | Jun 9, 2023 |
Ex-dividend Sep 29, 2026
¥50.00
Semi-Annual
Record Sep 30, 2026 · Payment Sep 29, 2026
Ex-dividend Mar 30, 2027
¥50.00
Semi-Annual
Record Mar 31, 2027 · Payment Mar 30, 2027
Ex-dividend Mar 30, 2026
¥100
Annual
Record Mar 31, 2026 · Payment Jun 9, 2026
Ex-dividend Mar 28, 2025
¥70.00
Annual
Record Mar 31, 2025 · Payment Jun 10, 2025
Ex-dividend Mar 28, 2024
¥70.00
Annual
Record Mar 31, 2024 · Payment Jun 11, 2024
Ex-dividend Mar 30, 2023
¥100
Annual
Record Mar 31, 2023 · Payment Jun 9, 2023
AI-generated and delayed market data for informational and educational purposes only. Not investment advice.
