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NYSETechnologySemiconductors
Latest quote
$45.985
+$0.225 · +0.49%
Established in 1984 and headquartered in Kaohsiung, Taiwan, ASE Technology Holding Co., Ltd. operates as a leading global provider of essential services for the semiconductor industry. Its primary business encompasses a full range of semiconductor packaging and testing solutions, alongside electronic manufacturing services, catering to an international clientele spanning the United States, Taiwan, various other Asian countries, and Europe. The company offers an extensive portfolio of packaging services, featuring advanced techniques such as flip chip ball grid array (BGA) and chip scale package (CSP) formats. This also includes a variety of quad flat packages (including low profile and thin versions), bump chip carriers, and advanced quad flat no-lead (QFN) packages. ASE specializes in cutting-edge solutions like plastic BGAs, 3D chip packages, and stacked die integration, utilizing both copper and silver wire bonding. Further sophisticated offerings include specialized flip chip BGAs with heat-spreaders, hybrid FCCSPs, innovative package in package (PiP) and package on package (PoP) assemblies, advanced single-sided substrates, high-bandwidth PoP, fan-out wafer-level packaging, SESUB technology, and 2.5D silicon interposers. Additionally, the company produces IC wire bonding packages, system-in-package (SiP) products and modules, and provides critical interconnect materials, including the assembly of electronic components for the automotive sector. In the domain of semiconductor testing, ASE delivers a comprehensive array of services. These range from initial front-end engineering testing and wafer probing to the final verification of a diverse set of components, such as logic, mixed-signal, radio frequency (RF) modules, SiP, micro-electro-mechanical systems (MEMS), and discrete devices. The company also manages associated test services and drop shipment logistics. Beyond its core semiconductor operations, ASE Technology Holding diversifies its ventures significantly. This includes the development, construction, sale, leasing, and management of real estate properties. The company also manufactures substrates, offers information software solutions, provides equipment leasing and investment advisory services, and manages warehousing operations. Furthermore, ASE is involved in processing and distributing computer and communication peripherals, electronic components, telecommunications equipment, and motherboards, actively participating in the import and export of goods and technology.
Regular session
$45.965
+$0.205 · +0.45%
Regular session · ET · Market data may be delayed.
Established in 1984 and headquartered in Kaohsiung, Taiwan, ASE Technology Holding Co., Ltd. operates as a leading global provider of essential services for the semiconductor industry. Its primary business encompasses a full range of semiconductor packaging and testing solutions, alongside electronic manufacturing services, catering to an international clientele spanning the United States, Taiwan, various other Asian countries, and Europe. The company offers an extensive portfolio of packaging services, featuring advanced techniques such as flip chip ball grid array (BGA) and chip scale package (CSP) formats. This also includes a variety of quad flat packages (including low profile and thin versions), bump chip carriers, and advanced quad flat no-lead (QFN) packages. ASE specializes in cutting-edge solutions like plastic BGAs, 3D chip packages, and stacked die integration, utilizing both copper and silver wire bonding. Further sophisticated offerings include specialized flip chip BGAs with heat-spreaders, hybrid FCCSPs, innovative package in package (PiP) and package on package (PoP) assemblies, advanced single-sided substrates, high-bandwidth PoP, fan-out wafer-level packaging, SESUB technology, and 2.5D silicon interposers. Additionally, the company produces IC wire bonding packages, system-in-package (SiP) products and modules, and provides critical interconnect materials, including the assembly of electronic components for the automotive sector. In the domain of semiconductor testing, ASE delivers a comprehensive array of services. These range from initial front-end engineering testing and wafer probing to the final verification of a diverse set of components, such as logic, mixed-signal, radio frequency (RF) modules, SiP, micro-electro-mechanical systems (MEMS), and discrete devices. The company also manages associated test services and drop shipment logistics. Beyond its core semiconductor operations, ASE Technology Holding diversifies its ventures significantly. This includes the development, construction, sale, leasing, and management of real estate properties. The company also manufactures substrates, offers information software solutions, provides equipment leasing and investment advisory services, and manages warehousing operations. Furthermore, ASE is involved in processing and distributing computer and communication peripherals, electronic components, telecommunications equipment, and motherboards, actively participating in the import and export of goods and technology.
Day range
Current $45.965
52-week range
Current $45.965
Regular session · ET · Market data may be delayed.
GoAI Score
Hold
Valuation
70
Undervalued
Sentiment
58
Mixed
Risk
46
Elevated Risk
Momentum
70
Gaining
Full GoAI research
Thesis, catalysts, evidence, and risk analysis.
Established in 1984 and headquartered in Kaohsiung, Taiwan, ASE Technology Holding Co., Ltd. operates as a leading global provider of essential services for the semiconductor industry. Its primary business encompasses a full range of semiconductor packaging and testing solutions, alongside electronic manufacturing services, catering to an international clientele spanning the United States, Taiwan, various other Asian countries, and Europe. The company offers an extensive portfolio of packaging services, featuring advanced techniques such as flip chip ball grid array (BGA) and chip scale package (CSP) formats. This also includes a variety of quad flat packages (including low profile and thin versions), bump chip carriers, and advanced quad flat no-lead (QFN) packages. ASE specializes in cutting-edge solutions like plastic BGAs, 3D chip packages, and stacked die integration, utilizing both copper and silver wire bonding. Further sophisticated offerings include specialized flip chip BGAs with heat-spreaders, hybrid FCCSPs, innovative package in package (PiP) and package on package (PoP) assemblies, advanced single-sided substrates, high-bandwidth PoP, fan-out wafer-level packaging, SESUB technology, and 2.5D silicon interposers. Additionally, the company produces IC wire bonding packages, system-in-package (SiP) products and modules, and provides critical interconnect materials, including the assembly of electronic components for the automotive sector. In the domain of semiconductor testing, ASE delivers a comprehensive array of services. These range from initial front-end engineering testing and wafer probing to the final verification of a diverse set of components, such as logic, mixed-signal, radio frequency (RF) modules, SiP, micro-electro-mechanical systems (MEMS), and discrete devices. The company also manages associated test services and drop shipment logistics. Beyond its core semiconductor operations, ASE Technology Holding diversifies its ventures significantly. This includes the development, construction, sale, leasing, and management of real estate properties. The company also manufactures substrates, offers information software solutions, provides equipment leasing and investment advisory services, and manages warehousing operations. Furthermore, ASE is involved in processing and distributing computer and communication peripherals, electronic components, telecommunications equipment, and motherboards, actively participating in the import and export of goods and technology.
Day range
Current $45.965
52-week range
Current $45.965
Profitability as a percentage of reported revenue.
Revenue
Operating income
Net income
| Metric (TWD) | FY2025 | FY2024 | FY2023 | FY2022 | FY2021 |
|---|---|---|---|---|---|
| Revenue | 648.92B TWD | 607.72B TWD | 574.18B TWD | 679.14B TWD | 564.46B TWD |
| Cost of goods sold | 534.1B TWD | 514.23B TWD | 488.46B TWD | 546.58B TWD | 459.57B TWD |
| Gross profit | 114.82B TWD | 93.49B TWD | 85.73B TWD | 132.56B TWD | 104.89B TWD |
| Research and development | 33.03B TWD | 29.43B TWD | 25.16B TWD | 24.67B TWD | 20.85B TWD |
| Selling, general, and administrative | 30.75B TWD | 22.99B TWD | 19.7B TWD | 25.6B TWD | 21.78B TWD |
| Operating expenses | 63.78B TWD | 52.41B TWD | 44.86B TWD | 50.28B TWD | 42.63B TWD |
| Interest income | — | 1.85B TWD | 1.51B TWD | 21.96M TWD | 19.42M TWD |
| Interest expense | 5.63B TWD | 6.75B TWD | 6.38B TWD | 134.5M TWD | 101.36M TWD |
| Depreciation and amortization | 67.44B TWD | 59.95B TWD | 56.25B TWD | 55.01B TWD | 53.25B TWD |
| Operating income | 51.03B TWD | 41.08B TWD | 40.87B TWD | 82.28B TWD | 62.26B TWD |
| Net income | 40.88B TWD | 33.15B TWD | 31.3B TWD | 62.86B TWD | 63.29B TWD |
Company facts updated Oct 8, 2026.
Recent quarterly results
Recent quarterly results
Funds reporting this stock among their holdings, ordered by reported position size.
iShares Semiconductor ETFSOXX430.79M0.89%48.6B USD0.33%$573.9-1.53%
Avantis Emerging Markets Equity ETFAVEM173.58M0.60%28.72B USD0.33%$93.56-1.46%
Direxion Daily Semiconductor Bull 3X ETFSOXL156.63M0.62%25.25B USD0.91%$151.08-4.93%
YieldMax Semiconductor Portfolio Option Income ETFCHPY58.61M4.27%1.36B USD1.03%$69.34-1.06%
Amplify CWP International Enhanced Dividend Income ETFIDVO43.29M3.03%1.43B USD0.65%$41.24-0.55%
Dimensional - Emerging Core Equity Market ETFDFAE30.09M0.30%10.2B USD0.29%$39.105-1.46%
Avantis Emerging Markets Value ETFAVES27.47M1.73%1.57B USD0.36%$65.03-1.08%
Dimensional - Emerging Markets Value ETFDFEV18.33M0.83%2.2B USD0.46%$42.285-1.18%iShares Semiconductor ETFSOXXAvantis Emerging Markets Equity ETFAVEMDirexion Daily Semiconductor Bull 3X ETFSOXLYieldMax Semiconductor Portfolio Option Income ETFCHPYAmplify CWP International Enhanced Dividend Income ETFIDVODimensional - Emerging Core Equity Market ETFDFAEAvantis Emerging Markets Value ETFAVESDimensional - Emerging Markets Value ETFDFEVAI-generated and delayed market data for informational and educational purposes only. Not investment advice.
