加载中
NYSETechnologySemiconductors
最新数据
US$47.03
−US$0.50 · -1.05%
Established in 1984 and headquartered in Kaohsiung, Taiwan, ASE Technology Holding Co., Ltd. operates as a leading global provider of essential services for the semiconductor industry. Its primary business encompasses a full range of semiconductor packaging and testing solutions, alongside electronic manufacturing services, catering to an international clientele spanning the United States, Taiwan, various other Asian countries, and Europe. The company offers an extensive portfolio of packaging services, featuring advanced techniques such as flip chip ball grid array (BGA) and chip scale package (CSP) formats. This also includes a variety of quad flat packages (including low profile and thin versions), bump chip carriers, and advanced quad flat no-lead (QFN) packages. ASE specializes in cutting-edge solutions like plastic BGAs, 3D chip packages, and stacked die integration, utilizing both copper and silver wire bonding. Further sophisticated offerings include specialized flip chip BGAs with heat-spreaders, hybrid FCCSPs, innovative package in package (PiP) and package on package (PoP) assemblies, advanced single-sided substrates, high-bandwidth PoP, fan-out wafer-level packaging, SESUB technology, and 2.5D silicon interposers. Additionally, the company produces IC wire bonding packages, system-in-package (SiP) products and modules, and provides critical interconnect materials, including the assembly of electronic components for the automotive sector. In the domain of semiconductor testing, ASE delivers a comprehensive array of services. These range from initial front-end engineering testing and wafer probing to the final verification of a diverse set of components, such as logic, mixed-signal, radio frequency (RF) modules, SiP, micro-electro-mechanical systems (MEMS), and discrete devices. The company also manages associated test services and drop shipment logistics. Beyond its core semiconductor operations, ASE Technology Holding diversifies its ventures significantly. This includes the development, construction, sale, leasing, and management of real estate properties. The company also manufactures substrates, offers information software solutions, provides equipment leasing and investment advisory services, and manages warehousing operations. Furthermore, ASE is involved in processing and distributing computer and communication peripherals, electronic components, telecommunications equipment, and motherboards, actively participating in the import and export of goods and technology.
常规交易时段
US$47.03
−US$0.50 · -1.05%
盘中时间采用ET。市场数据可能有所延迟。
Established in 1984 and headquartered in Kaohsiung, Taiwan, ASE Technology Holding Co., Ltd. operates as a leading global provider of essential services for the semiconductor industry. Its primary business encompasses a full range of semiconductor packaging and testing solutions, alongside electronic manufacturing services, catering to an international clientele spanning the United States, Taiwan, various other Asian countries, and Europe. The company offers an extensive portfolio of packaging services, featuring advanced techniques such as flip chip ball grid array (BGA) and chip scale package (CSP) formats. This also includes a variety of quad flat packages (including low profile and thin versions), bump chip carriers, and advanced quad flat no-lead (QFN) packages. ASE specializes in cutting-edge solutions like plastic BGAs, 3D chip packages, and stacked die integration, utilizing both copper and silver wire bonding. Further sophisticated offerings include specialized flip chip BGAs with heat-spreaders, hybrid FCCSPs, innovative package in package (PiP) and package on package (PoP) assemblies, advanced single-sided substrates, high-bandwidth PoP, fan-out wafer-level packaging, SESUB technology, and 2.5D silicon interposers. Additionally, the company produces IC wire bonding packages, system-in-package (SiP) products and modules, and provides critical interconnect materials, including the assembly of electronic components for the automotive sector. In the domain of semiconductor testing, ASE delivers a comprehensive array of services. These range from initial front-end engineering testing and wafer probing to the final verification of a diverse set of components, such as logic, mixed-signal, radio frequency (RF) modules, SiP, micro-electro-mechanical systems (MEMS), and discrete devices. The company also manages associated test services and drop shipment logistics. Beyond its core semiconductor operations, ASE Technology Holding diversifies its ventures significantly. This includes the development, construction, sale, leasing, and management of real estate properties. The company also manufactures substrates, offers information software solutions, provides equipment leasing and investment advisory services, and manages warehousing operations. Furthermore, ASE is involved in processing and distributing computer and communication peripherals, electronic components, telecommunications equipment, and motherboards, actively participating in the import and export of goods and technology.
日内区间
当前US$47.03
52周区间
当前US$47.03
盘中时间采用ET。市场数据可能有所延迟。
GoAI 评分
持有
估值
70
低估
情绪
58
多空交织
风险
46
风险偏高
动量
70
动能增强
完整 GoAI 研究
继续查看更深入的依据、催化因素和风险。
Established in 1984 and headquartered in Kaohsiung, Taiwan, ASE Technology Holding Co., Ltd. operates as a leading global provider of essential services for the semiconductor industry. Its primary business encompasses a full range of semiconductor packaging and testing solutions, alongside electronic manufacturing services, catering to an international clientele spanning the United States, Taiwan, various other Asian countries, and Europe. The company offers an extensive portfolio of packaging services, featuring advanced techniques such as flip chip ball grid array (BGA) and chip scale package (CSP) formats. This also includes a variety of quad flat packages (including low profile and thin versions), bump chip carriers, and advanced quad flat no-lead (QFN) packages. ASE specializes in cutting-edge solutions like plastic BGAs, 3D chip packages, and stacked die integration, utilizing both copper and silver wire bonding. Further sophisticated offerings include specialized flip chip BGAs with heat-spreaders, hybrid FCCSPs, innovative package in package (PiP) and package on package (PoP) assemblies, advanced single-sided substrates, high-bandwidth PoP, fan-out wafer-level packaging, SESUB technology, and 2.5D silicon interposers. Additionally, the company produces IC wire bonding packages, system-in-package (SiP) products and modules, and provides critical interconnect materials, including the assembly of electronic components for the automotive sector. In the domain of semiconductor testing, ASE delivers a comprehensive array of services. These range from initial front-end engineering testing and wafer probing to the final verification of a diverse set of components, such as logic, mixed-signal, radio frequency (RF) modules, SiP, micro-electro-mechanical systems (MEMS), and discrete devices. The company also manages associated test services and drop shipment logistics. Beyond its core semiconductor operations, ASE Technology Holding diversifies its ventures significantly. This includes the development, construction, sale, leasing, and management of real estate properties. The company also manufactures substrates, offers information software solutions, provides equipment leasing and investment advisory services, and manages warehousing operations. Furthermore, ASE is involved in processing and distributing computer and communication peripherals, electronic components, telecommunications equipment, and motherboards, actively participating in the import and export of goods and technology.
日内区间
当前US$47.03
52周区间
当前US$47.03
盈利能力占已公布营收的百分比。
营收
营业利润
净利润
| 项目（TWD） | 2025财年 | 2024财年 | 2023财年 | 2022财年 | 2021财年 |
|---|---|---|---|---|---|
| 营收 | 6489.22亿 TWD | 6077.24亿 TWD | 5741.83亿 TWD | 6791.4亿 TWD | 5644.56亿 TWD |
| 销货成本 | 5341.04亿 TWD | 5142.32亿 TWD | 4884.55亿 TWD | 5465.8亿 TWD | 4595.66亿 TWD |
| 毛利 | 1148.18亿 TWD | 934.92亿 TWD | 857.28亿 TWD | 1325.59亿 TWD | 1048.9亿 TWD |
| 研究与开发 | 330.32亿 TWD | 294.27亿 TWD | 251.61亿 TWD | 246.7亿 TWD | 208.49亿 TWD |
| 销售、一般及管理费用 | 307.52亿 TWD | 229.88亿 TWD | 196.98亿 TWD | 256.05亿 TWD | 217.77亿 TWD |
| 营业费用 | 637.84亿 TWD | 524.14亿 TWD | 448.59亿 TWD | 502.75亿 TWD | 426.26亿 TWD |
| 利息收入 | — | 18.54亿 TWD | 15.13亿 TWD | 2196.18万 TWD | 1941.61万 TWD |
| 利息支出 | 56.3亿 TWD | 67.48亿 TWD | 63.8亿 TWD | 1.34亿 TWD | 1.01亿 TWD |
| 折旧和摊销 | 674.4亿 TWD | 599.51亿 TWD | 562.53亿 TWD | 550.15亿 TWD | 532.5亿 TWD |
| 营业利润 | 510.34亿 TWD | 410.78亿 TWD | 408.69亿 TWD | 822.84亿 TWD | 622.64亿 TWD |
| 净利润 | 408.81亿 TWD | 331.54亿 TWD | 313.04亿 TWD | 628.56亿 TWD | 632.86亿 TWD |
公司数据更新于 2026年10月13日。
| 行动 | 生效日期 | 详情 | 记录日期 | 付款日期 |
|---|---|---|---|---|
股票拆分 | 2018年4月18日 | 5:4 | — | — |
股票拆分 | 2012年8月20日 | 1,139:1,000 | — | — |
股票拆分 | 2011年8月12日 | 557:500 | — | — |
股票拆分 | 2010年7月27日 | 109:100 | — | — |
股票拆分 | 2008年8月13日 | 1,029:1,000 | — | — |
股票拆分 | 2007年8月20日 | 11,479:10,000 | — | — |
已生效 2018年4月18日
5:4
已生效 2012年8月20日
1,139:1,000
已生效 2011年8月12日
557:500
已生效 2010年7月27日
109:100
已生效 2008年8月13日
1,029:1,000
已生效 2007年8月20日
11,479:10,000
报告持有此股票敞口的交易所交易基金。
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